Products and Solutions

C550 3D Mesh Supernode

Introduction

The C550 3D Mesh Supernode, developed by MetaX and its partners, delivers powerful multi-precision computing capabilities. It supports 3D Mesh topology with low-cost, low-latency electrical interconnection for a supernode of up to 8 servers and 64 cards. It perfectly supports ultra-large-scale computing centers, general-purpose computing, and data processing applications.

Product Features

Standard OAM server featuring self-developed GPGPU and mainstream CPU
Single supernode supports 64-card in-memory semantic electrical interconnect with ultra-low communication latency
3D mesh architecture with open bus technology enables hyperscale data center deployment
Full-stack solution from chip to cabinet for rapid deployment
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